Equipped with a high-energy micro-focus X-ray tube and a flat-panel digital detector, providing high-resolution image analysis for PCBA solder joints, metal foreign objects, or structural defect detection. Supports AI image recognition and automatic classification algorithms, complying with IPC standards and ISO quality control specifications.

Product Features:

• High-Resolution Imaging:Features a micro-focus X-ray source and a high-sensitivity flat-panel detector, delivering high-contrast, high-clarity images.
• Automatic Defect Recognition (AI-DI):Built-in intelligent image analysis function can instantly mark voids, cracks, bridges, and abnormal solder joints.
• Multi-Angle 3D Inspection (AXI Optional):Supports angled and tomographic scans, accurately reconstructing internal structures to eliminate blind spots.
• High-Speed Scanning & Positioning:Optimized motion platform design and automatic alignment algorithms effectively improve production line inspection efficiency.
• Complete Traceability & Reporting:Real-time recording of each inspection result, supports MES/ERP system integration, enhancing quality assurance transparency.

Applicable Industries:

✔️ Semiconductor packaging and testing

✔️ SMT assembly

✔️ PCB inspection

✔️ LED module inspection

✔️ BGA/CSP/LGA solder joint analysis

✔️ Battery and industrial electronics inspection

✔️ Medical imaging inspection